Soracom has announced the completion of Proof of Concept (PoC) that demonstrates integrated SIM (iSIM) capability designed to support the next generation of IoT devices. This next-generation iSIM capability that addresses the needs of advanced IoT devices and small form factors is the result of joint effort between Soracom, Sony Semiconductor Israel, and Kigen.
Unlike the conventional cellular applications in which a hardware communications module is used to establish a network connection and a SIM card or eSIM to validate identity, the new iSIM capability solves the purpose within a single, purpose-built system-on-a-chip (SoC). This technology addresses multiple key challenges simultaneously, thereby streamlining supply chains and allowing significant reductions in the circuit board footprint, circuit complexity, manufacturing cost, and power requirements while increasing processing capacity, Moreover, the iSIM is highly threat-resistant which is one of the major reasons why it is gaining attention as a next-generation SIM technology.
While working on PoC, a hardware-secured area was established within Sony’s Altair ALT1250 cellular IoT chipset and a unique Soracom carrier profile was provisioned on the Kigen iSIM OS. This next-generation iSIM technology can deliver full functionality including the generation of Soracom’s unique key information, secure loading of the carrier profile information onto the module, connection to the cellular network, and connection to Soracom’s advanced platform services.