Taoglas has recently launched its System-on-Module (SoM) portfolio for rapid IoT deployment.

U-blox has released NEO-M9L-20A, NEO-M9L-01A modules, and the M9140-KA-DR chip that are specially designed for first-mount automotive solutions. Suitable for integration on the roof, behind the windscreen, or inside hot electronics control units (ECUs), these new automo

New Versal AI Edge adaptive compute acceleration platforms (ACAPs) from Xilinx is designed to enable AI innovation from edge to the endpoint in automotive, robotics, healthcare, and aerospace applications. These ACAPs offer 4 times higher AI performance

With the integration of Gallium Nitride (GaN) technology into its multi-chip module platform, NXP has hit the major industry milestone for 5G energy efficiency.

The Trigger under-dash telematics antenna family from Laird Connectivity is designed for discrete or covert mounting underneath vehicle dashboards.

Soracom has announced the completion of Proof of Concept (PoC) that demonstrates integrated SIM (iSIM) capability designed to support the next generation of IoT devices.

With the rising demand for battery-operated IoT devices, the adoption of low-power Wi-Fi too has intensified.

Xilinx has introduced the Versal AI Edge series for enabling AI innovation from the edge to the endpoint.

Silicon Labs and Wirepas have joined hands to come up with a combined hardware and software solution for large-scale mesh networks in IoT applications like asset tracking and building automation.

According to a recent Transforma Insights research study, the number of IoT devices around the world is predicted to grow from 7.6 billion in 2019 to 24 billion in 2030.